Non-destructive real-time material fingerprinting with cold atmospheric plasma and AI
Measure silicon wafer thickness and chemical composition in real-time; Detect defects in battery electrode coatings; Monitor thermal barrier coating microstructure on jet turbine blades; Classify polymer film contaminants in medical devices; Verify SiO2 TeOS layer uniformity in semiconductor fabrication
Awarded $2.4M in BRIDGE funding by California Energy Commission; Developed from UC Berkeley Chemical Engineering Department; Supported by UC Berkeley Skydeck and Lawrence Berkeley National Laboratory; Validated in battery, semiconductor, and aerospace production environments